BORON NITRIDE PASTE, HIGH TEMPERATURE RESISTANT, MOLD RELEASE, 50 GR.

50 gr
Qty:
BORON NITRIDE PASTE 
 
Weight: 50 gr.  
 
Content: wurtzite boron nitride powder (10/7 micron), 40% in water/alcohol soluble composition.

Properties: high thermal resistance and conductivity, dielectric strength (eliminates the risk of shorting out)
According to Ioffe Institute, thermal expansion of wurtzite boron nitride is the lowest among other materials, read more.  


Grain size:  10/7 micron  (see particle  size distribution diagram of wurtzite boron nitride powder)
  
Available on stock 

Application
Mold release, detaching and protective for high temperatures (up to 2000 °C), thermal  conductor.   

How it works: apply uniform layer; composition will evaporate under high temperature, leaving boron nitride on the surface; to some extent it's also stress resistant.

Why it's better: 
- Thermal expansion of wurtzite boron nitride (according to Ioffe Institute) is approx. 1.5 lower than that of hexagonal boron nitride and consequently of other materials. Which means higher stability of coating layer under high temperatures;
-  Thermal conductivities of wurtzite crystal, parallel and perpendicular to the axis, are identical. Which means higher stability of thermal properties in comparison to hexagonal boron nitride. 

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  • Model: Wurtzite
  • Manufacturer: AbrasiveTools, Ukraine